Qualcomm’s Snapdragon Technology Summit in Hawaii is still going and new bits and pieces about the company future products are incoming. Yesterday the company announced the arrival of its latest flagship chipset Snapdragon 845 and now the company took the time to list its detailed specs. The new SoC will have octa-core CPU, clocked at up to 2.8 GHz, new GPU and AI platform, based on the Hexagon 685 DSP.
The eight CPU cores are Kryo 385 that due to a redesign of the platform will provide 25% performance uplift. Four of them are dedicated for performance and are based on the Cortex-A75 architecture, while the other four are based on the Cortex-A55 and run up to 1.8 GHz.
The new GPU is Adreno 630, and Qualcomm promises 30% faster graphics and 30% better power efficiency. The new unit should bring 2.5x faster display throughput, meaning a 2K x 2K display can efficiently run at 120 Hz.
The keywords VR and AR are also in the game with out-of-the-box eye tracking, hand tracking, and multiview rendering. Qualcomm even goes as far as to call the Adreno 630 a Visual Processing Subsystem.
The Hexagon 685 DSP now also works as an AI image co-processor. Being three times faster than the Hexagon 682 that is in the Snapdragon 835, it will support Android 8.1 Oreos Neural Networks API. This means better always-on keyword detection and ultra-low-power voice processing.
The connectivity can now reach 1,200 Mbps downlink thanks to the X20 cellular modem. There are also proprietary enhancements for Bluetooth 5, which should reduce battery consumption of wireless earbuds in half.
Qualcomm is expected to start shipping the Snapdragon 845 to smartphone manufacturers in early 2018. As already announced by Lei Jun, Xiaomi CEO, one of the first flagships with it will be the Xiaomi Mi 7, but previous rumors put the Samsung Galaxy S9 as being the first.